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Smart Anything Everywhere

Cyber-Physical Systems Engineering Labs is part of the Smart Anything Everywhere initiative.

This project has received funding from the European Union's Horizon 2020 research and innovation programme under grant agreement No 644400.

IoT Connectivity Platform

This is a solution for IoT based on a network of nodes with mesh topology that communicate through a Std.IEEE802.15.4 Physical Layer under a 6LowPAN over IPv6 to implement Link and Network Layers. The Transport Layer is UDP and the Application Layer is based on CoAP. More characteristics are as follows:

  • Network of nodes with mesh topology:
    • Nodes are plug-and-play, so, the deployment of the network infrastructure is easy to do.
    • Auto-configurable and auto-routing capabilities.
    • Robust communication network where connectivity among nodes is guaranteed.
  • Implementation: Open Hardware, resulting in a modular and inexpensive design. The devices firmware is Contiki OS.
  • Nodes are designed using a modular architecture in such a way that different sensors and actuators can be easily integrated in nodes, obtaining different types of nodes IPv6 compatible.
  • Communications: Std.IEEE802.15.4 Physical Layer under a 6LowPAN over IPv6 to implement Link and Network Layers. Transport Layer is UDP and the Application Layer is based on CoAP.
  • Security: Information encryption is done accordingly with AES-128.
  • Connection to Internet is done through a border router that can group up to 200 nodes.

Read more information about this platform here.

Design centre

This platform is supported by our Spain design centre.

Spain design centre